Heat sink Details for LS305


Thermal Performance:
20.00 °C/W

Stock Category:
A

(click here for category definition)

All dimensions shown are subject to commercial tolerances. Details of individual tolerances and fully dimensioned drawings available on request.

Where a device is shown it is for illustrative purposes only. The heat sink is supplied without device. Most board mount and bga heatsinks are supplied black anodised to assist thermal performance.

Thermal Resistance is calculated based on a distributed heat load on anodised heatsink with vertically mounted fins based on a 60ºC temperature rise. Under general operating conditions the thermal mounting arrangement of devices is not known and therefore the figures should be used only as a guide to selection.
We recommend that the effectiveness of any heat sink is tested in the specific operating environment in which it will be subjected.
All information is for reference purposes only.

Please see the accessories page for more details on clips, wire forms and interface material or contact us.

This heatsink is suitable
for use with device(s):
TO220